Corintis builds tiny liquid cooling channels that sit directly on or near a chip's surface, pulling heat away right at the source rather than relying on fans or larger cooling systems further away. This approach is becoming essential as AI chips push past power levels that traditional cooling methods can no longer handle.

Traditional cooling solutions work at the system level, but Corintis' microfluidic technology operates at the chip level, channeling coolant through microscale structures directly on or near the silicon die. This removes heat much closer to its source than conventional approaches, enabling chips to run at higher power levels without thermal throttling.

Corintis raised $24M in Series A funding in late 2025, adding Intel CEO Lip Bu Tan to their board. They partnered with Microsoft to show 3x better cooling with microfluidics versus cooling alternatives.