Eliyan makes high-speed connection technology that lets multiple small chips inside a processor package communicate with each other as if they were a single large chip. Their approach works with standard, affordable packaging materials rather than requiring expensive specialty components, making chiplet-based designs more practical.

Unlike silicon interposers or bridges that are expensive and supply-constrained, Eliyan's interconnect works on standard organic packaging substrates while still achieving the bandwidth density typically associated with advanced packaging. This means chiplet-based designs can achieve high performance without the cost premium of exotic packaging technologies.

The shift to chiplet-based AI processor designs — combining specialized compute, memory, and networking dies — is creating strong demand for Eliyan's high-bandwidth interconnect technology that makes chiplet integration practical and affordable. Eliyan raised $62M in Series B funding in 2025 and announced key partnerships with semiconductor manufacturers, as its NuLink technology gained traction as a critical enabler of next-generation chiplet architectures.